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z-power led x10490 z-power led x10490 technical data sheet document no. : ssc-qp-7-07-24 (rev.00) rev.01 rev.01 december 2010 december 2010 www.seoulsemicon.com www.seoulsemicon.com specification checked by approved by HB601R customer supplier drawn by approved by
z-power led x10490 z-power led x10490 technical data sheet document no. : ssc-qp-7-07-24 (rev.00) rev.01 rev.01 december 2010 december 2010 www.seoulsemicon.com www.seoulsemicon.com contents 1. description 2. absolute maximum ratings 3. electro-optical characteristics 4. characteristic diagram 5. rank 6. material 7. outline dimension 8. packing 9. soldering 10. precaution for use
z-power led x10490 z-power led x10490 technical data sheet document no. : ssc-qp-7-07-24 (rev.00) rev.01 rev.01 december 2010 december 2010 www.seoulsemicon.com www.seoulsemicon.com HB601R features applications 1. description HB601R ? cellular phone?s keypad lightning ? other decoration lighting - small size suitable for compact appliances - surface-mounted and leadless chip led device - high brightness, wide variety of colors are available - tape and reel packing - increases the life time of battery ? 2.1 x 1.0 x 0.6 mm ? side type ? wavelength : 470 nm
z-power led x10490 z-power led x10490 technical data sheet document no. : ssc-qp-7-07-24 (rev.00) rev.01 rev.01 december 2010 december 2010 www.seoulsemicon.com www.seoulsemicon.com 2. absolute maximum ratings 3. electro-optical characteristics *1 i fm conditions: pulse width tw 0.1ms and duty ratio 1/10 (ta=25 ) (ta=25 ) parameter symbol value unit power dissipation p d 64 mw forward current i f 20 ma peak forward current i fm *1 50 ma reverse voltage v r 5 v operation temperature t opr. -35 ~ 85 storage temperature t stg. -40 ~ 100 parameter symbol condition min typ max unit forward voltage v f i f =5 ? 2.7 3.05 3.2 v reverse current i r v r =5v - - 10 ? luminous intensity *2 i v i f =5 ? 14 17 40 mcd wavelength d i f =5 ? 466 470 475 nm spectral bandwidth ? i f =5 ? - 25 - nm viewing angle *3 2 1/2 i f =5 ? - 120 - ? *2 the luminous intensity iv is measured at the peak of the spatial pattern which ma y not be aligned with the mechanical axis o f the led package. *3 1/2 is the off-axis where the luminous in tensity is 1/2 t he peak intensity. [note] all products confirm to the listed minimum and maximum specifications for electric and optical characteristics, when ope rated at 20ma within the maximum ratings shown above. all measurem ents were made under the standardized environment of ssc. (tolerance : i v 10 %, d 2 nm, v f 0.1 v)
z-power led x10490 z-power led x10490 technical data sheet document no. : ssc-qp-7-07-24 (rev.00) rev.01 rev.01 december 2010 december 2010 www.seoulsemicon.com www.seoulsemicon.com 4. electro-optical characteristic diagram forward current vs. forward voltage relative luminous intensity vs forward current ambient temperature vs. allowable forward current radiation diagram 0 20406080100 0 5 10 15 20 25 forward current i f (ma) ambient temperature ta( o & ) 0 30 60 90 120 150 180 0 5 10 15 20 25 30 50 100 150 200 250 300 350 400 relative intensity i v [%] for w a r d cur r e n t i f [ma] 2.9 3.0 3.1 3.2 3.3 3.4 3.5 1 10 forward current i f (ma ) fo r w a r d v o l t a g e v f (v )
z-power led x10490 z-power led x10490 technical data sheet document no. : ssc-qp-7-07-24 (rev.00) rev.01 rev.01 december 2010 december 2010 www.seoulsemicon.com www.seoulsemicon.com spectrum 400 500 600 700 800 0.0 0.2 0.4 0.6 0.8 1.0 intensity[a.u.] wavelength [nm]
z-power led x10490 z-power led x10490 technical data sheet document no. : ssc-qp-7-07-24 (rev.00) rev.01 rev.01 december 2010 december 2010 www.seoulsemicon.com www.seoulsemicon.com v f [v] i v [mcd] d [nm] bin at i f =5[ma] at i f =5[ma] at i f =5[ma] 2.7-2.9 14-23 466-469 1 2.9-3.2 14-23 466-469 2 2.7-2.9 14-23 469-472 3 2.9-3.2 14-23 469-472 4 2.7-2.9 14-23 472-475 5 2.9-3.2 14-23 472-475 6 2.7-2.9 23-40 466-469 7 2.9-3.2 23-40 466-469 8 2.7-2.9 23-40 469-472 9 2.9-3.2 23-40 469-472 10 2.7-2.9 23-40 472-475 11 2.9-3.2 23-40 472-475 12 5. rank 6.metarial item pcb chip wire encapsulate electrode material bt-resin ingan gold epoxy au
z-power led x10490 z-power led x10490 technical data sheet document no. : ssc-qp-7-07-24 (rev.00) rev.01 rev.01 december 2010 december 2010 www.seoulsemicon.com www.seoulsemicon.com 7.outline dimension ( tolerance: 0.1, unit: mm ) 0.3 polarity mark 0.3 2.1 0.6 0.5 1.0 1.7 anode cathode ( 1 ) (1) (4)
z-power led x10490 z-power led x10490 technical data sheet document no. : ssc-qp-7-07-24 (rev.00) rev.01 rev.01 december 2010 december 2010 www.seoulsemicon.com www.seoulsemicon.com 8. packing (1) quantity: 3,000pcs./reel (2) cumulative tolerance: cumula tive tolerance/10pitches to be 0.2mm (3) adhesion strength of cover tape: adhesion strength to be 0.1-0.7n when the over tape is turned off from the carrier tape at10 ? angle to be the carrier tape. (4) package: p/n, manufacturing data code no. and quantity to be indicated on a damp proof package. tolerance: 0.2, unit: L 2.0 8.0 1.75 1.5 180 3.5 (2.75) 2 13 22 0.5 1.15 2.4 60 0.8 11.4 9 4.0 0.2
z-power led x10490 z-power led x10490 technical data sheet document no. : ssc-qp-7-07-24 (rev.00) rev.01 rev.01 december 2010 december 2010 www.seoulsemicon.com www.seoulsemicon.com reel packing structure a b c rohs a b seoul semiconductor co.,ltd date : c acriche semiconductor ecolight tuv made in korea q'yt : 30, 000ea lot no : code : chip led 142 245 7inch 220 outer box *material: paper(sw3b(b)) size(mm) type aluminum vinyl bag x | h u { p { ? g a g z w w w reel lot number: ########## y h u r a ## z z j g w h y { g u | t i l y a g o i ] w x y HB601R HB601R z z j g w h y { g u | t i l y a g o i ] w x y lot number: ########## x | h u { p { ? g a g z w w w y h u r a ## part : HB601R
z-power led x10490 z-power led x10490 technical data sheet document no. : ssc-qp-7-07-24 (rev.00) rev.01 rev.01 december 2010 december 2010 www.seoulsemicon.com www.seoulsemicon.com 9 . soldering lead solder pre-heat 120~150 pre-heat time 120 sec. max. peak-temperature 240 max. soldering time condition 10 sec. max. lead free solder pre-heat 150~200 pre-heat time 120 sec. max. peak-temperature 260 max. soldering time condition 10 sec. max. lead solder 2.5~5 c / sec. o o o pre-heating 120~150 c 120sec. max. 60sec. max. above 200 c o 240 c max. 10 sec. max. 2.5~5 c / sec. 260 c max. 10 sec. max. o 60sec. max. above 220 c 120sec. max. pre-heating 150~200 c 1~5 c / sec. o o o o 1~5 c / sec. lead-frame solder (1) lead solder (2) lead-free solder (3) hand soldering conditions do not exceed 3 seconds at maximum 280oc under soldering iron. note : in case that the soldered products are reused in soldering process, we don?t guarantee the products.
z-power led x10490 z-power led x10490 technical data sheet document no. : ssc-qp-7-07-24 (rev.00) rev.01 rev.01 december 2010 december 2010 www.seoulsemicon.com www.seoulsemicon.com 10. precaution for use (1) storage in order to avoid the absorption of moisture, it is recommended to store in a dry box (or a desiccator) with a desiccant. otherwise, to store them in the following environment is recommended. temperature : max 30oc humidity : max 65%rh (2) attention after open. led is correspond to smd, when led be soldered dip, interfacial separation may affect the light transmission efficiency, causing the light intensity to drop. attention in followed; a. after opened and mounted the soldering shall be quickly. b. keeping of a fraction temperature : 5 ~ 40oc humidity : less than 30% (3) in the case of more than 1 week passed after opening or change color of indicator on desiccant, components shall be dried 10-12hr. at 60 5oc. (4) any mechanical force or any excess vibrat ion shall not be accepted to apply during cooling process to normal temperature after soldering. (5) quick cooling shall be avoided. (6) components shall not be mounted on warped direction of pcb. (7) anti radioactive ray design is not considered for the products. (8) this device should not be used in any type of fluid such as water, oil, organic solvent etc. when washing is required, ipa should be used. (9) when the leds are illuminating, oper ating current should be decided after considering the ambient maximum temperature. (10) leds must be stored to maintain a clean atmosphere. if the leds are stored for 3 months or more after being shipped from ssc, a sealed container with a nitrogen atmosphere should be used for storage. (11) the leds must be soldered within se ven days after opening the moisture-proof packing. (12) repack unused products with anti-moist ure packing, fold to close any opening and then store in a dry place. (13) the appearance and specifications of the product may be modi fied for improvement without notice.

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